International Electrotechnical Commission

Publication detail

Reference	IEC 60749-19 ed1.1 Consol. with am1 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength
Publication date	2010-11-29
Format, price (Swiss francs) and language	40.- 13 pages 40.- 886 Kb
Abstract	IEC 60749-19:2003+A1:2010 determines the integrity of materials and procedures used to attach semiconductor die to package headers or other substrates. This test method is generally only applicable to cavity packages or as a process monitor. It is not applicable for die areas greater than 10 mm2. It is also not applicable to flip chip technology or to flexible substrates. This consolidated version consists of the first edition (2003) and its amendment 1 (2010). Therefore, no need to order amendment in addition to this publication.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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