International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-17 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Publication date	2011-01-27
Format, price (Swiss francs) and language	170.- 53 pages 170.- 1344 Kb
Abstract	IEC 60191-6-17:2011 provides outline drawings and dimensions for stacked packages and individual stackable packages in the form of FBGA or FLGA.
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

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