Publication detail
| Reference | IEC 60191-6-12 ed2.0 |
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| Title | Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) | |||||||||
| Publication date | 2011-06-08 | |||||||||
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| Abstract | IEC 60191-6-12:2011 provides standard outline drawings, dimensions, and recommended variations for all fine-pitch land grid array packages (FLGA) with terminal pitch of 0,8 mm or less. This edition includes the following significant changes with respect to the previous edition: - scope is expanded so that this standard include the square type FLGA. The title of this standard has been changed accordingly: "Rectangular type" has been deleted from the title; - ball pitch of 0,3 mm has been added; - datum is changed from the body datum to the ball datum; - combination lists of D, E, MD, and ME have been revised. |
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| Technical Committee | 47D - Semiconductor devices packaging
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| Stability date | 2015 | |||||||||
| Work in progress |
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