International Electrotechnical Commission

Publication detail

Reference	IEC 60749-40 ed1.0 withdrawn corrigendum	> preview
Title	Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Publication date	2011-07-13
Format, price (Swiss francs) and language	130.- 44 pages 130.- 1777 Kb
Abstract	IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
Technical Committee	47 - Semiconductor devices
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2015
Work in progress	Project Stage code Forecast publication date No project under development - -

Search

>> Advanced search

Quick access by ref. number

Basket

Your basket is empty

Your country is :
Your TVA is : You must login...

Payment

Just Published

1. IEC 60601-1-SER Ed. 1.0
2. IEC 60601-1 Ed. 3.0
3. IEC 60838-2-1-am2 Ed. 1.0
4. IEC/TS 62720 Ed. 1.0
5. IEC/TR 62655 Ed. 1.0
6. IEC 61710 Ed. 2.0
7. IEC 60099-5 Ed. 2.0

>> Published in the last 30 days

Bestsellers

1. IEC 61000-4-2 Ed. 2.0
2. IEC 62471 Ed. 1.0
3. IEC 60068-2-14 Ed. 6.0
4. IEC 60079-0 Ed. 6.0
5. IEC 61010-1 Ed. 3.0
6. IEC 61400-12-2 Ed. 1.0
7. IEC 62304 Ed. 1.0
8. IEC 60229 Ed. 3.0
9. IEC 60529 Ed. 2.1
10. IEC 60812 Ed. 2.0