IEC > Webstore > Search > Register > Check out > Payment > Order confirmation

Publication detail

 
Reference IEC 60749-40 ed1.0 withdrawn corrigendum
> preview
Title Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
Publication date 2011-07-13
Format, price
(Swiss francs)
and language
130.- 44 pages
130.- 1777 Kb
 
Abstract IEC 60749-40:2011 is intended to evaluate and compare drop performance of a surface mount semiconductor device for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure. The purpose is to standardize test methodology to provide a reproducible assessment of the drop test performance of a surface mounted semiconductor devices while duplicating the failure modes normally observed during product level test. This international standard uses a strain gauge to measure the strain and strain rate of a board in the vicinity of a component.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


Search

>> Advanced search

Quick access by ref. number



Basket

Your basket is empty
Your country is :
Your TVA is : You must login...

Payment

Accepted credit cards:
Prices in CHF (Swiss francs)
Request a pro forma to pay by bank transfer or cheque
Learn how to share your publications with your colleagues, using networking options
Prices in CHF (Swiss francs)
We accept the following credit cards:
To pay by bank transfer: request a pro forma
If you purchase regularly through the IEC Webstore you can open a corporate account

Just Published

>> Published in the last 30 days

Bestsellers

  1. IEC 60601-1-2 Ed. 4.0
  2. IEC 62682 Ed. 1.0
  3. IEC 60825-1 Ed. 3.0
  4. IEC 61010-1 Ed. 3.0
  5. IEC 61000-4-5 Ed. 3.0
  6. IEC 60529 Ed. 2.2
  7. IEC 60079-0 Ed. 6.0
  8. IEC 61000-3-2 Ed. 4.0
  9. IEC 61439-1 Ed. 2.0
  10. IEC 61439-2 Ed. 2.0