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Reference IEC 62047-10 ed1.0 withdrawn corrigendum
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Title Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
Publication date 2011-07-26
Format, price
(Swiss francs)
and language
45.- 22 pages
45.- 1151 Kb
 
Abstract IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
Technical Committee 47F - Micro-electromechanical systems  RSS
ICS Codes
31.080.99 Other semiconductor devices
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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