| Reference |
IEC/PAS 62647-23 ed1.0 withdrawn corrigendum |
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|
| Title |
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
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| Publication date |
2011-07-28 |
Format, price (Swiss francs) and language |
 | 230.- |
| 43 pages |  | 230.- |
| 1181 Kb |
|
| |
| Abstract |
IEC/PAS 62647-23:2011(E) provides technical background, procurement guidance, engineering procedures, and guidelines to assist organizations reworking/repairing aerospace and high performance electronic systems, whether they were assembled or previously reworked/repaired using traditional alloys such as SnPb or Pb-free alloys, or a combination of both solders and surface finishes.
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| Technical Committee |
107 - Process management for avionics
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| ICS Codes |
| 03.100.50 |
Production. Production management
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| 31.020 |
Electronic components in general
*Magnetic components, see 29.100.10
|
| 49.060 |
Aerospace electric equipment and systems
*Including Avionics |
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| |
| Replaced by |
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| Stability date |
2014 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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