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Reference IEC 60749-30 ed1.1 Consol. with am1 withdrawn corrigendum
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Title Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing
Publication date 2011-08-10
Format, price
(Swiss francs)
and language
95.- 28 pages
95.- 1106 Kb
 
Abstract IEC 60749-30:2005+A1:2011 establishes a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing. The test method defines the preconditioning flow for non-hermetic solid-state SMDs representative of a typical industry multiple solder reflow operation. These SMDs should be subjected to the appropriate preconditioning sequence described in this standard prior to being submitted to specific in-house reliability testing (qualification and/or reliability monitoring) in order to evaluate long term reliability (impacted by soldering stress). This consolidated version consists of the first edition (2005) and its amendment 1 (2011). Therefore, no need to order amendment in addition to this publication.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
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