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Reference IEC 60068-2-83 ed1.0 withdrawn corrigendum
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Title Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
Publication date 2011-09-07
Format, price
(Swiss francs)
and language
210.- 76 pages
210.- 1738 Kb
 
Abstract IEC 60068-2-83:2011 provides methods for comparative investigation of the wettability of the metallic terminations or metallized terminations of SMDs with solder pastes. Data obtained by these methods are not intended to be used as absolute quantitative data for pass - fail purposes.
NOTE: Different solderability test methods for SMD are described in IEC 60068-2-58 and IEC 60068-2-69. IEC 60068-2-58 prescribes visual evaluation using solder bath and reflow method, IEC 60068-2-69 prescribes wetting balance evaluation using solder bath and solder globule method.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
19.040 Environmental testing
*Including testing equipment

31.190 Electronic component assemblies
*Including preassembled modules
 
Replaced by
Stability date 2015
 
Work in progress
ProjectStage codeForecast publication date
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