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Reference IEC 62137-3 ed1.0 withdrawn corrigendum
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Title Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Publication date 2011-11-08
Format, price
(Swiss francs)
and language
230.- 90 pages
230.- 2472 Kb
Abstract IEC 62137-3:2011 describes the selection methodology of an appropriate test method for a reliability test for solder joints of various shapes and types of surface mount devices (SMD), array type devices and leaded devices, and lead insertion type devices using various types of solder material alloys. This first edition cancels and replaces IEC/PAS 62137-3, published in 2008, and includes some editorial revisions. The main changes with respect to the PAS include the following:
- no technical changes;
- some editorial changes and corrections;
- for the sake of convenience some constitutive changes.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules
Replaced by
Stability date 2017
Work in progress
ProjectStage codeForecast publication date
No project under development--


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