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Reference IEC 62258-5 ed1.0 withdrawn corrigendum
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Title Semiconductor die products - Part 5: Requirements for information concerning electrical simulation
Publication date 2006-08-29
Format, price
(Swiss francs)
and language
50.- 24 pages
50.- 953 Kb
Abstract IEC 62258-5:2006 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This part of IEC 62258 specifies the information required to facilitate the use of electrical data and models for simulation of the electrical behaviour and verification of the correct functionality of electronic systems that include bare semiconductor die, with or without connection structures, and/or minimally packaged semiconductor die. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of IEC 62258-1 and IEC 62258-2.

This publication is to be read in conjunction with IEC 62258-1:2009 and IEC 62258-2:2011.
Technical Committee 47 - Semiconductor devices  RSS
ICS Codes
31.080.99 Other semiconductor devices
Replaced by
Stability date 2018
Work in progress
ProjectStage codeForecast publication date
No project under development--


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