Publication detail

Reference

IEC/TR 62258-4 ed2.0

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Title

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

Publication date

2012-08-08

Format, price
(Swiss francs)
and language

	100.-		37 pages
	100.-		939 Kb

Abstract

IEC/TR 62258-4:2012 has been developed to facilitate the production, supply and use of semiconductor die products, including:
- wafers;
- singulated bare die;
- die and wafers with attached connection structures;
- minimally or partially encapsulated die and wafers.
This technical report contains a questionnaire, based on the requirements of other parts of IEC 62258, which may be used in negotiations and contracts between suppliers and purchasers of die devices. It is intended to assist all those involved in the supply chain for die devices to comply with the requirements of the IEC 62258-1:2009 and IEC 62258-2:2011 standards. It should be recognized that the tables contained in this technical report form a checklist of information that can potentially be supplied and that it may not be relevant or possible to complete all fields. Different markets may require different subsets of the information requested herein. This edition includes the following significant technical changes with respect to the previous edition: The document checklist was changed to mirror IEC 62258-1:2009 requirements exactly.

Technical Committee

47 - Semiconductor devices

ICS Codes

31.080.99

Other semiconductor devices

Stability date

2016

Work in progress

Project	Stage code	Forecast publication date
No project under development	-	-

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