| Reference |
IEC/TS 62647-2 ed1.0 withdrawn corrigendum |
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|
| Title |
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
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| Publication date |
2012-11-29 |
Format, price (Swiss francs) and language |
 | 280.- |
| 68 pages |  | 280.- |
| 5486 Kb |
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| |
| Abstract |
IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
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| Technical Committee |
107 - Process management for avionics
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| ICS Codes |
| 03.100.50 |
Production. Production management
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| 31.020 |
Electronic components in general
*Magnetic components, see 29.100.10
|
| 49.060 |
Aerospace electric equipment and systems
*Including Avionics |
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| Replaced by |
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| Stability date |
2016 |
| |
| Work in progress |
| Project | Stage code | Forecast publication date |
|---|
| No project under development | - | - |
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