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Reference IEC 60191-6-22 ed1.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Publication date 2012-12-11
Format, price
(Swiss francs)
and language
80.- 34 pages
80.- 1092 Kb
 
Abstract IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080.01 Semiconductor devices in general
 
Replaced by
Stability date 2022
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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