International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-22 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Publication date	2012-12-11
Format, price (Swiss francs) and language	80.- 34 pages 80.- 1092 Kb
Abstract	IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2022
Work in progress	Project Stage code Forecast publication date No project under development - -

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