International Electrotechnical Commission

Publication detail

Reference	IEC 60191-6-2 ed1.0 withdrawn corrigendum	> preview
Title	Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages
Publication date	2001-12-11
Format, price (Swiss francs) and language	40.- 21 pages 40.- 951 Kb
Abstract	IEC 60191-6-2:2001 covers the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
Technical Committee	47D - Semiconductor devices packaging
ICS Codes	31.080.01 Semiconductor devices in general
Replaced by
Stability date	2016
Work in progress	Project Stage code Forecast publication date No project under development - -

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