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Reference IEC 62739-1 ed1.0 withdrawn corrigendum
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Title Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
Publication date 2013-06-18
Format, price
(Swiss francs)
and language
100.- 36 pages
100.- 1349 Kb
 
Abstract IEC 62739-1:2013 provides an evaluating test method for the erosion of the metallic materials without surface processing intended to be used for lead-free wave soldering equipment as a solder bath and other components which are in contact with the molten solder.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.190 Electronic component assemblies
*Including preassembled modules

31.240 Mechanical structures for electronic equipment
 
Replaced by
Stability date 2018
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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