|Reference||IEC 62483 ed1.0 withdrawn corrigendum||
|Title||Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices|
|Abstract||IEC 62483:2013 describes the methodology applicable for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers on semiconductor devices. This methodology may not be sufficient for applications with special requirements, (i.e. military, aerospace, etc.). Additional requirements may be specified in the appropriate requirements (procurement) documentation. This first edition is based on JEDEC documents JESD201A and JESD22-A121A and replaces IEC/PAS 62483, published in 2006. This first edition constitutes a technical revision. This edition includes the following significant technical changes with respect to the previous edition:
a) The content of IEC/PAS 62483 was added to the content of JESD201A as Annex A.
b) A methodology was introduced for environmental acceptance testing of tin-based surface finishes and mitigation practices for tin whiskers.
c) A Clause 6 was introduced detailing the reporting requirements of test results.
|Technical Committee||47 - Semiconductor devices|
|Work in progress||
Quick access by ref. number
|Your basket is empty|
|Accepted credit cards:|
|Prices in CHF (Swiss francs)|
|Request a pro forma to pay by bank transfer or cheque|
|Learn how to share your publications with your colleagues, using networking options|
- IEC 60730-1 Ed. 5.0
- IEC 60947-1-am2 Ed. 5.0
- IEC 60793-1-50 Ed. 2.0
- IEC 60794-3 Ed. 4.0
- IEC/TR 61641 Ed. 3.0
- IEC 61076-2-104 Ed. 2.0
- IEC 60297-3-108 Ed. 1.0