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Publication detail

 
Reference IEC 60191-4 ed3.0 withdrawn corrigendum
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Title Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Publication date 2013-10-10
Format, price
(Swiss francs)
and language
150.- 48 pages
150.- 1218 Kb
 
Abstract IEC 60191-4:2013 specifies a method for the designation of package outlines and for the classification of forms of package outlines for semiconductor devices and a systematic method for generating universal descriptive designators for semiconductor device packages. The descriptive designator provides a useful communication tool but has no implied control for assuring package interchangeability. This edition includes the following significant technical changes with respect to the previous edition:
a) Material code "S" is added to indicate a silicon based package.
b) Description of "WL" is added to be used for general use.
Technical Committee 47D - Semiconductor devices packaging  RSS
ICS Codes
31.080 Semiconductor devices
*Semiconducting materials, see 29.045
 
Replaced by
Stability date 2018
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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