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Reference IEC 61760-1 ed2.0 withdrawn corrigendum
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Title Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Publication date 2006-04-10
Format, price
(Swiss francs)
and language
170.- 60 pages
170.- 1240 Kb
Abstract IEC 61760-1:2006-04(en-fr) gives a reference set of process conditions and related test conditions to be used when compiling component specifications of electronic components that are intended for usage in surface mount technology. The main changes with regard to the previous edition concern:
- requirements related to lead-free soldering;
- extension of the scope to include also components mounted by gluing;
- direct reference to IEC 60068-2-58 for requirements on solderability and resistance to soldering heat;
- classification into categories based on the component's ability to withstand resistance to soldering heat has been deleted.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.240 Mechanical structures for electronic equipment
Replaced by
Stability date 2018
Work in progress
ProjectStage codeForecast publication date
No project under development--


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