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Publication detail

 
Reference IEC/TR 62866 ed1.0 withdrawn corrigendum
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Title Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
Publication date 2014-05-07
Format, price
(Swiss francs)
and language
300.- 187 pages
300.- 4838 Kb
 
Abstract IEC TR 62866:2014 describes the history of the degradation of printed wiring boards caused by electrochemical migration, the measurement method, observation of the failure and remarks to testing in detail.
Technical Committee 91 - Electronics assembly technology  RSS
ICS Codes
31.180 Printed circuits and boards
 
Replaced by
Stability date 2016
 
Work in progress
ProjectStage codeForecast publication date
No project under development--


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