IEC 60191-6-4
IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
CHFÂ 80.-
Technical committee
TC 47/SC 47D Semiconductor devices packaging| Publication type | International Standard |
| Publication date | 2003-06-11 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2027 |
| ISBN number | 9782832205211 |
| Pages | 32 |
| File size | 1.10 MB |
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