IEC 61189-3-720 Pre-release version
IEC 61189-3-720:2026 PRV
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Test methods for interconnection structures (circuit boards) - Transmission loss test method for high frequency multilayer circuit boards
This Final Draft International Standard is an up to 6 weeks' pre-release of the official publication. It is available for sale during its voting period: 2026-07-03 to 2026-08-14. By purchasing this FDIS now, you will automatically receive, in addition, the final publication.
IEC 61189-3-720:2026 specifies the S parameter test method for the internal transmission circuit of a multilayer circuit board (CB) for high frequency up to 50 GHz. The transmission loss test method that applies the via in pad plated over (VIPPO) structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. In addition, the use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.
IEC 61189-3-720:2026 specifies the S parameter test method for the internal transmission circuit of a multilayer circuit board (CB) for high frequency up to 50 GHz. The transmission loss test method that applies the via in pad plated over (VIPPO) structure to the CB surface contributes to improving the signal loss measurement precision and signal integrity of the internal transmission circuit of the high frequency CB. In addition, the use of back-drilling with VIPPO structure can eliminate influence of stubs on signal transmission.
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