IEC 61191-2 Revised
IEC 61191-2:1998
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
Prescribes the requirements for surface mounted solder connections. The requirements pertain to those assemblies that are totally surface mounted or to the surface mounted portions of those assemblies that include other related technologies (e.g. through-hole, chip mounting, terminal mounting, etc.).
CHFÂ 155.-
A more recent version of this publication exists:
IEC 61191-2:2017/COR1:2019