IEC Publicly Available Specification 62185 Replaced
IEC PAS 62185:2000
Thermal shock test method
This test is conducted to determine the resistance of a part to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
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This publication has been replaced by:
IEC 60749-11:2002
Technical committee
TC 47 Semiconductor devicesCategory
Quality Assurance| Publication type | Publicly Available Specification |
| Publication date | 2000-08-22 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Withdrawal date | 2002-04-12 |
| ISBN number | 2831853095 |
| Pages | 7 |
| File size | 137.06 KB |