IEC 61189-3-719
IEC 61189-3-719:2016
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
IEC 61189-3-719:2016 specifies a test method to monitor the resistance of single plated-through holes (PTHs) in printed circuit boards (PCBs) to determine the PTH durability under thermo-mechanical stress induced by temperature cycling.
CHFÂ 40.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2016-01-05 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2028 |
| ISBN number | 9782832230954 |
| Pages | 22 |
| File size | 1.29 MB |
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