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IEC 62047-25

IEC 62047-25:2016
Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area
IEC 62047-25:2016 specifies the in-situ testing method to measure the bonding strength of micro bonding area which is fabricated by micromachining technologies used in silicon-based micro-electromechanical system (MEMS). This document is applicable to the in-situ pull-press and shearing strength measurement of the micro bonding area fabricated by microelectronic technology process and other micromachining technology.
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English/French
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Technical committee

TC 47/SC 47F Micro-electromechanical systems

Keywords

Sensors
Publication typeInternational Standard
Publication date2016-08-29
Edition1.0
ICS

31.080.99

Stability date2026
ISBN number9782832236093
Pages45
File size1.62 MB
EditionDatePublicationEditionStatus

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