IEC 63055 Revised
IEC 63055:2016
Format for LSI-Package-Board Interoperable design
IEC 63055:2016(E) defines a common interoperable format that will be used for the design of
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
a) large-scale integration (LSI),
b) packages for such LSI, and
c) printed circuit boards on which the packaged LSI are interconnected. Collectively, such designs are referred to as "LSI-Package-Board" (LPB) designs. The format provides a common way to specify information/data about the project management, netlists, components, design rules, and geometries used in LPB designs. This standard is published as a double logo IEC-IEEE standard.
CHF 425.-
A more recent version of this publication exists: IEC 63055:2023
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 2016-11-08 |
| Edition | 1.0 |
| ICS | 31.180 31.200 35.060 |
| Stability date | 2023 |
| ISBN number | 9782832236864 |
| Pages | 194 |
| File size | 8.46 MB |
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