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IEC 60286-3 Revised

IEC 60286-3:2019
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
IEC 60286-3:2019 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes. This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips). This edition includes the following significant technical changes with respect to the previous edition: - addition of a table of the classification to symbols concerning tape, reel and common symbols;
- additions of a figure of example of polarity and orientation and a figure of example of dot seal;
- revision of requirements for camber;
- addition of a definition of design value with regard to tilt.
BASE PUBLICATION
English/French
  CHF 295.-
A more recent version of this publication exists: IEC 60286-3:2022 CMV

Technical committee

TC 40 Capacitors and resistors for electronic equipment
Publication typeInternational Standard
Publication date2019-01-16
Edition6.0
ICS

31.020

31.240

Withdrawal date2022-11-15
ISBN number9782832263877
Pages84
File size3.00 MB
EditionDatePublicationEditionStatus
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