IEC Technical Specification 62647-4
IEC TS 62647-4:2018
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 4: Ball grid array (BGA) re-balling
IEC TS 62647-4:2018(E) defines the requirements for replacing solder balls on ball grid array (BGA) component packages in the context of an electronic components management plan (ECMP) for aerospace, defence and high reliability products. The intent of this document is to provide re-balling companies (hereinafter referred to as the re-balling provider) with the administrative and technical requirements to be incorporated within existing processes or for establishing, implementing and maintaining a new set of processes or the creation of a stand-alone re-balling process.
CHFÂ 280.-
Technical committee
TC 107 Process management for avionics| Publication type | Technical Specification |
| Publication date | 2018-04-10 |
| Edition | 1.0 |
| ICS | 03.100.50 31.020 49.060 |
| Stability date | 2028 |
| ISBN number | 9782832255308 |
| Pages | 41 |
| File size | 1.26 MB |
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