IEC 62878-1
IEC 62878-1:2019
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
IEC 62878-1:2019 specifies the generic requirements and test methods for device-embedded substrates. The basic test methods for printed board substrate materials and substrates themselves are specified in IEC 61189-3.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
This part of IEC 62878 is applicable to device-embedded substrates fabricated by use of organic base material, which includes, for example, active or passive devices, discrete components formed in the fabrication process of electronic printed boards, and sheet-formed components.
The IEC 62878 series applies neither to the re-distribution layer (RDL) nor to electronic modules defined in IEC 62421.
CHFÂ 115.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2019-10-14 |
| Edition | 1.0 |
| ICS | 31.180 31.190 |
| Stability date | 2030 |
| ISBN number | 9782832279496 |
| Pages | 19 |
| File size | 1.20 MB |
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