IEC 60749-22
IEC 60749-22:2002
Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength
Applicable to semiconductor devices (discrete devices and integrated circuits), this test measures bond strength or determine compliance with specified bond strength requirements. The contents of the corrigendum of August 2003 have been included in this copy.
CHFÂ 155.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2002-09-12 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2026 |
| ISBN number | 2831865565 |
| Pages | 41 |
| File size | 596.36 KB |
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