IEC 61188-5-1 Replaced
IEC 61188-5-1:2002
Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
Provides information on land pattern geometries used for the surface attachment of electronic components. The intent of the information presented herein is to provide the appropriate size, shape and tolerance of surface-mount land patterns to insure sufficient area for the appropriate solder fillet, and also to allow for inspection, testing, and rework of those solder joints.
CHFÂ 380.-
This publication has been replaced by:
IEC 61188-6-1:2021
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 2002-07-12 |
| Edition | 1.0 |
| ICS | 31.180 31.190 |
| Withdrawal date | 2021-02-23 |
| ISBN number | 2831864496 |
| Pages | 141 |
| File size | 6.26 MB |
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