IEC 61188-5-2
IEC 61188-5-2:2003
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
Provides information on land pattern geometries used for the surface attachment of discrete electronic components. Provides the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and rework of resulting solder joints.
CHFÂ 320.-
This publication has been partially replaced by:
IEC 61188-6-3:2024
IEC 61188-6-2:2021
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 2003-06-24 |
| Edition | 1.0 |
| ICS | 31.180 31.190 |
| Stability date | 2025 |
| ISBN number | 2831870704 |
| Pages | 103 |
| File size | 1.34 MB |
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