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IEC 61189-1:1997+AMD1:2001 CSV
IEC 61189-1
IEC 61189-1:1997
Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
This series relates to test methods for printed boards and printed board assemblies, as well as related materials or component robustness, irrespective of their method of manufacture. This part contains test methods for evaluating printed boards and other forms of interconnection structures. The methods are designed to achieve uniformity and reproducibility in the procedures and test methodologies.
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Consolidated version
The content of amendment(s) is incorporated into the publication. The track changes mode shows where the publication has been modified by the amendment.
DiscoverTechnical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 1997-03-27 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2028 |
| ISBN number | 2831837529 |
| Pages | 37 |
| File size | 125.67 KB |
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