IEC 61189-11
IEC 61189-11:2013
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
IEC 61189-11:2013 describes the measurement method of melting ranges of solder alloys that are mainly used for wiring of electrical equipment, for electrical and communication equipment, and for other apparatus, as well as for connecting components.
CHFÂ 80.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2013-05-07 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2028 |
| ISBN number | 9782832208007 |
| Pages | 30 |
| File size | 5.26 MB |
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