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IEC 61189-2

IEC 61189-2:2006
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
Provides a catalogue of test methods representing methodologies and procedures that can be applied to test materials used for manufacturing interconnection structures (printed boards) and assemblies.
BASE PUBLICATION
English
  CHF 365.-

Technical committee

TC 91 Electronics assembly technology
Publication typeInternational Standard
Publication date2006-05-30
Edition2.0
ICS

31.180

Stability date2028
ISBN number2831884683
Pages122
File size1.17 MB
EditionDatePublicationEditionStatus
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