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IEC 61190-1-1

IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
BASE PUBLICATION
English/French

Technical committee

TC 91 Electronics assembly technology
Publication typeInternational Standard
Publication date2002-03-25
Edition1.0
ICS

31.190

Stability date2027
ISBN number2831862337
Pages41
File size573.55 KB
EditionDatePublicationEditionStatus

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