IEC 61190-1-1
IEC 61190-1-1:2002
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
Specifies general requirements for the classification and testing of soldering fluxes for high-quality interconnections in electronics assembly. This standard is a flux characterization, quality control, and procurement document for solder flux and flux containing material in electronics assembly technology.
CHFÂ 155.-
Technical committee
TC 91 Electronics assembly technologyPublication type | International Standard |
Publication date | 2002-03-25 |
Edition | 1.0 |
ICS | 31.190 |
Stability date | 2027 |
ISBN number | 2831862337 |
Pages | 41 |
File size | 573.55 KB |
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