IEC 61190-1-2
IEC 61190-1-2:2014
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
IEC 61190-1-2:2014-02(en-fr) specifies general requirements for the characterization and testing of solder pastes used to make high-quality electronic interconnections in electronics assembly. This standard serves as a quality control document and is not intended to relate directly to the material's performance in the manufacturing process. This edition includes the following significant technical changes with respect to the previous edition:
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
a) modification of the solder powder size in Table 2;
b) addition of the information of "Reflow condition and profile" in Annex B;
c) addition of a new Annex C.
CHF 150.-
Technical committee
TC 91 Electronics assembly technologyCategory
Quality Assurance| Publication type | International Standard |
| Publication date | 2014-02-19 |
| Edition | 3.0 |
| ICS | 31.190 |
| Stability date | 2025 |
| ISBN number | 9782832214237 |
| Pages | 46 |
| File size | 1.34 MB |
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