IEC 61249-8-8
IEC 61249-8-8:1997
Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
Provides requirements for the qualification of temporary solder resist coatings.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.
CHFÂ 40.-
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 1997-06-24 |
| Edition | 1.0 |
| ICS | 31.180 |
| Stability date | 2026 |
| ISBN number | 2831838797 |
| Pages | 19 |
| File size | 89.65 KB |
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