IEC 60068-2-20 Revised
IEC 60068-2-20:2008
Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60068-2-20:2008 outlines Test T, applicable to devices with leads. Soldering tests for surface mounting devices (SMD) are described in IEC 60068-2-58. This standard provides procedures for determining the solderability and resistance to soldering heat of devices in applications using solder alloys, which are eutectic or near eutectic tin lead (Pb), or lead-free alloys. The procedures in this standard include the solder bath method and soldering iron method. The objective of this standard is to ensure that component lead or termination solderability meets the applicable solder joint requirements of IEC 61191-3 and IEC 61191-4. In addition, test methods are provided to ensure that the component body can resist against the heat load to which it is exposed during soldering. The major technical changes with regard to the fourth edition are the following:
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.
- the solder globule test is deleted;
- test conditions and requirements for lead-free solders are added.
CHFÂ 115.-
A more recent version of this publication exists:
IEC 60068-2-20:2021 RLV
Technical committee
TC 91 Electronics assembly technology| Publication type | International Standard |
| Publication date | 2008-07-21 |
| Edition | 5.0 |
| ICS | 19.040 |
| Withdrawal date | 2021-03-30 |
| ISBN number | 9782889100378 |
| Pages | 40 |
| File size | 1.06 MB |
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