IEC 62047-10
IEC 62047-10:2011
Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials
IEC 62047-10:2011 specifies micro-pillar compression test method to measure compressive properties of MEMS materials with high accuracy, repeatability, and moderate effort of specimen fabrication. The uniaxial compressive stress-strain relationship of a specimen is measured, and the compressive modulus of elasticity and yield strength can be obtained. This standard is applicable to metallic, ceramic, and polymeric materials. The contents of the corrigendum of February 2012 have been included in this copy.
CHFÂ 40.-
Technical committee
TC 47/SC 47F Micro-electromechanical systems| Publication type | International Standard |
| Publication date | 2011-07-26 |
| Edition | 1.0 |
| ICS | 31.080.99 |
| Stability date | 2026 |
| ISBN number | 9782889126064 |
| Pages | 22 |
| File size | 1.10 MB |
Ensure availability and sustainable management of water and sanitation for all
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation
Take urgent action to combat climate change and its impacts
Strengthen the means of implementation and revitalize the global partnership for sustainable development