IEC 62047-18
IEC 62047-18:2013
Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials
IEC 62047-18:2013 specifies the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 micrometre and 10 micrometre. This International Standard specifies the bend testing and test piece shape for micro-sized smooth cantilever type test pieces, which enables a guarantee of accuracy corresponding to the special features.
CHFÂ 80.-
Technical committee
TC 47/SC 47F Micro-electromechanical systems| Publication type | International Standard |
| Publication date | 2013-07-17 |
| Edition | 1.0 |
| ICS | 31.080.99 |
| Stability date | 2027 |
| ISBN number | 9782832209820 |
| Pages | 26 |
| File size | 1.40 MB |
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