Share by email

IEC 62047-8

IEC 62047-8:2011
Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-8:2011 specifies the strip bending test method to measure tensile properties of thin films with high accuracy, repeatability, moderate effort of alignment and handling compared to the conventional tensile test. This testing method is valid for test pieces with a thickness between 50 nm and several mum, and with an aspect ratio (ratio of length to thickness) of more than 300. The hanging strip (or bridge) between two fixed supports are widely adopted in MEMS or micro-machines. It is much easier to fabricate these strips than the conventional tensile test pieces. The test procedures are so simple to be readily automated. This international standard can be utilized as a quality control test for MEMS production since its testing throughput is very high compared to the conventional tensile test.
BASE PUBLICATION
English/French
  CHF 115.-

Technical committee

TC 47/SC 47F Micro-electromechanical systems
Publication typeInternational Standard
Publication date2011-03-14
Edition1.0
ICS

31.080.99

Stability date2026
ISBN number9782889123957
Pages36
File size1.52 MB
EditionDatePublicationEditionStatus
  • Ensure availability and sustainable management of water and sanitation for all

  • Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation

  • Take urgent action to combat climate change and its impacts

  • Strengthen the means of implementation and revitalize the global partnership for sustainable development

See more

Related publications