IEC 63378-3
IEC 63378-3:2025
Thermal standardization on semiconductor packages - Part 3: Thermal circuit simulation models of discrete semiconductor packages for transient analysis
IEC 63378-3:2025 specifies the thermal circuit network model of discrete (TO‑243, TO‑252 and TO‑263) packages, which is used in the transient analysis of electronic devices to estimate precise junction temperatures without experimental verification.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
This model is intended to be made and provided by semiconductor suppliers and to be used by assembly makers of electronic devices.
CHFÂ 80.-
Technical committee
TC 47/SC 47D Semiconductor devices packaging| Publication type | International Standard |
| Publication date | 2025-05-06 |
| Edition | 1.0 |
| ICS | 31.080.01 |
| Stability date | 2029 |
| ISBN number | 9782832703991 |
| Pages | 29 |
| File size | 1.21 MB |
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