IEC 63068-4
IEC 63068-4:2022
Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 4: Procedure for identifying and evaluating defects using a combined method of optical inspection and photoluminescence
IEC 63068-4:2022(E) provides a procedure for identifying and evaluating defects in as-grown 4H-SiC (Silicon Carbide) homoepitaxial wafer by systematically combining two test methods of optical inspection and photoluminescence (PL). Additionally, this document exemplifies optical inspection and PL images to enable the detection and categorization of defects in SiC homoepitaxial wafers.
CHF 150.-
Technical committee
TC 47 Semiconductor devices| Publication type | International Standard |
| Publication date | 2022-07-27 |
| Edition | 1.0 |
| ICS | 31.080.99 |
| Stability date | 2026 |
| ISBN number | 9782832243077 |
| Pages | 25 |
| File size | 7.90 MB |
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