IEC Technical Specification 62647-2
IEC TS 62647-2:2012
Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 2: Mitigation of deleterious effects of tin
IEC/TS 62647-2:2012(E) establishes processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin in electronic systems. This Technical Specification is applicable to aerospace, defence, and high performance (ADHP) electronic applications which procure equipment that may contain Pb-free tin finishes. It may be used by other high-performance and high-reliability industries, at their discretion.
CHFÂ 365.-
Technical committee
TC 107 Process management for avionics| Publication type | Technical Specification |
| Publication date | 2012-11-29 |
| Edition | 1.0 |
| ICS | 03.100.50 31.020 49.060 |
| Stability date | 2028 |
| ISBN number | 9782832205198 |
| Pages | 68 |
| File size | 5.23 MB |
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