IEC 60747-15:2024 RLV
IEC 60747-15
a) The intelligent power semiconductor modules (IPM), which was previously excluded from the first and second edition, is now included in this document (Annex C);
b) The thermal resistance is described for each switch (6.2.4);
c) Added isolation test between temperature sensor and terminals, in case there is an agreement with the user (6.1.2).
All the changes between the new edition and previous edition of the publication are highlighted with track changes mode.
DiscoverTechnical committee
TC 47/SC 47E Discrete semiconductor devicesPublication type | International Standard |
Publication date | 2024-10-22 |
Edition | 3.0 |
ICS | 31.080.99 |
Stability date | 2029 |
ISBN number | 9782832297896 |
Pages | 115 |
File size | 4.91 MB |
Ensure healthy lives and promote well-being for all
Promote inclusive and sustainable economic growth, full and productive employment and decent work for all
Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation
Promote sustainable use of terrestrial ecosystems, halt and reverse land degradation and biodiversity loss