IEC 60191-6-19:2010
Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Abstract
IEC 60191-6-19:2010 specifies measurement methods of the package warpage at elevated temperature and the maximum permissible warpages for Ball Grid Array(BGA), Fine-pitch Ball Grid Array (FBGA), and Fine-pitch Land Grid Array (FLGA). This standard cancels and replaces IEC/PAS 60191-6-19 published in 2008. This first edition constitutes a technical revision.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2010-02-25 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2027 |
| Pages | 25 |
| File size | 1635 KB |
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