IEC 60191-6-22:2012
Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Abstract
IEC 60191-6-22:2012 provides the outline drawings and dimensions common to silicon-based package structures and materials of ball grid array packages (BGA) and land grid array packages (LGA).
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2012-12-11 |
| Edition | 1.0 |
| Available language(s) | English/French |
| TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2027 |
| Pages | 34 |
| File size | 1092 KB |
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