IEC 60191-6-3:2000 

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

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Abstract

IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.

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Additional information

Publication typeInternational Standard
Publication date2000-09-29
Edition1.0
Available language(s)English, English/French
TC/SCTC 47/SC 47D - Semiconductor devices packagingrss
ICS31.080.01 - Semiconductor devices in general
Stability date  2020
Pages34
File size1070 KB

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