IEC 60191-6-3:2000
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
Abstract
IEC 60191-6-3:2000 stipulates a method for quad flat packs (QFP) measuring dimensions which are classified into Form E.
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Additional information
| Publication type | International Standard |
|---|---|
| Publication date | 2000-09-29 |
| Edition | 1.0 |
| Available language(s) | English, English/French |
| TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
| ICS | 31.080.01 - Semiconductor devices in general |
| Stability date | 2027 |
| Pages | 34 |
| File size | 1070 KB |
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