Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)
|Publication type||International Standard|
|Available language(s)||English, English/French|
|TC/SC||TC 47/SC 47D - Semiconductor devices packagingrss|
|ICS||31.080.01 - Semiconductor devices in general|
|File size||1070 KB|
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