IEC 60191-6-4:2003
Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Abstract
IEC 60191-6-4:2003 covers the requirements for the measuring methods of ball grid array (BGA) dimensions.
Additional information
Publication type | International Standard |
---|---|
Publication date | 2003-06-11 |
Edition | 1.0 |
Available language(s) | English, English/French |
TC/SC | TC 47/SC 47D - Semiconductor devices packagingrss |
ICS | 31.080.01 - Semiconductor devices in general |
Stability date | 2027 |
Pages | 32 |
File size | 1156 KB |
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